发明名称 |
SURFACE PROTECTING ADHESIVE TAPE FOR USE IN SEMICONDUCTOR PROCESSING |
摘要 |
<p>Provided is a surface protecting adhesive tape for use in semiconductor processing, having an adhesive layer on a substrate, wherein the adhesive tape has a probe tack force B of 0.08 to 0.20 (MPa), and a ratio C (A/B) of an adhesive force A (N/25mm) of the adhesive tape to the probe tack force B (MPa) thereof is 10 (N/25mm/MPa) or more.</p> |
申请公布号 |
KR20140006105(A) |
申请公布日期 |
2014.01.15 |
申请号 |
KR20137032646 |
申请日期 |
2013.05.21 |
申请人 |
FURUKAWA ELECTRIC CO., LTD. |
发明人 |
UCHIYAMA TOMOAKI;YOKOI HIROTOKI |
分类号 |
C09J7/02;H01L21/56 |
主分类号 |
C09J7/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|