| 摘要 |
Provided is a process for producing a polyimide film laminate, which comprises applying a polyamic acid solution composition comprising a polyamic acid having a specified chemical composition and a specific mixed solvent onto a substrate and heating the resulting product under specified conditions. Specifically provided is a process for producing a polyimide film laminate comprising a substrate and a polyimide film, which comprises forming a coating film comprising a polyamic acid solution composition on the surface of a substrate to produce a laminate composed of the substrate and the polyamic acid solution composition, heating the laminate composed of the substrate and the polyamic acid solution composition at a temperature ranging from at least 150 to 200°C for 10 minutes or longer, and then heating the heated laminate at a temperature up to 400 to 550°C. The polyamic acid solution composition is prepared by dissolving a polyamic acid comprising 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and/or pyromellitic acid dianhydride and p-phenylenediamine in a mixed solvent comprising an organic polar solvent and a solvent which forms an azeotrope with water, and the content of the solvent which forms an azeotrope with water is 5-35 mass% relative to the total amount of the solvents. |
