METHODS OF FABRICATING SEMICONDUCTOR DEVICES

摘要

A semiconductor element forming method includes a step of preparing a first and second substrates, a step of forming metal wires on a first surface of the first substrate, a step of forming a filling insulating layer covering top surfaces of the metal wires and filling gaps between sides of the wires, a step of a buffer insualiating layer softer than the filling insulating layer on the filling insulating layer, a step of forming a capping insulating layer harder than the buffer insulating layer on the buffer insulating layer, and a step of bonding a surface of the second substrate and a surface of the capping insulating layer.