| 摘要 |
The present invention improves a through-put in a substrate treatment process by reducing a treatment tact of the substrate in a coating device. A resist coating device (24) comprises the following: a stage (70) lifting a glass substrate (G) to a predetermined height and returning the glass substrate (G) to a horizontal direction; two nozzles (80, 81) installed on the upper side of a coating stage (70b), for discharging resist liquid to the glass substrate (G) returned from the coating stage (70b); and two nozzle processing units (100, 110) installed on the upper side of the coating stage (70b) corresponding to the nozzles (80, 81), and operates a predetermined process to the nozzles (80, 81). |
