| 摘要 |
The present invention relates to an insert assembly which accommodates an electronic component, and to an electronic component accommodation apparatus including same. The insert assembly according to the present invention includes: an insert main body in which a through-hole is formed so that the electronic component is accommodated; a support sheet which is disposed below the through-hole to support the electronic component and has an opening into which solder balls provided on the lower surface of the electronic component are inserted; and a pusher which presses the electronic component in the horizontal direction so as to bring the solder balls into close contact with a first inner side surface of the opening and a second inner side surface which is vertical to the first inner side surface. Because the electronic component is aligned based on the solder balls, the electronic component can be more accurately positioned in the insert assembly. |
