摘要 |
Techniques for determining one or more heat transfer characteristic values of a structure, such as an electronic device, are disclosed. A heat flux vector magnitude and a temperature gradient vector magnitude for a portion of the structure are determined, and a product of the heat flux vector magnitude with the temperature gradient vector magnitude is obtained. More particularly, the dot product of the heat flux vector magnitude with the temperature gradient vector magnitude may be obtained to provide a bottleneck heat transfer characteristic value. Alternately or additionally, a cross product (or related operation) of the heat flux vector magnitude with the temperature gradient vector magnitude is obtained to produce a shortcut heat transfer characteristic value. |