发明名称 Thermal analysis
摘要 Techniques for determining one or more heat transfer characteristic values of a structure, such as an electronic device, are disclosed. A heat flux vector magnitude and a temperature gradient vector magnitude for a portion of the structure are determined, and a product of the heat flux vector magnitude with the temperature gradient vector magnitude is obtained. More particularly, the dot product of the heat flux vector magnitude with the temperature gradient vector magnitude may be obtained to provide a bottleneck heat transfer characteristic value. Alternately or additionally, a cross product (or related operation) of the heat flux vector magnitude with the temperature gradient vector magnitude is obtained to produce a shortcut heat transfer characteristic value.
申请公布号 US8628236(B2) 申请公布日期 2014.01.14
申请号 US201113091867 申请日期 2011.04.21
申请人 BORNOFF ROBIN;PARRY JOHN DAVID;BLACKMORE BYRON;DAVIES ALAN;MENTOR GRAPHICS CORPORATION 发明人 BORNOFF ROBIN;PARRY JOHN DAVID;BLACKMORE BYRON;DAVIES ALAN
分类号 G01K17/00;G01K3/00 主分类号 G01K17/00
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