发明名称 APPARATUS AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method for forming a line on the substrate and solidifying the same. SOLUTION: The substrate processing apparatus 100 includes: a stage 1100 for placing the substrate S; a discharge unit 1200 discharging ink I and forming a plurality of lines on the substrate S placed on the stage 1100; a solidifying unit 1400 for solidifying the discharged ink I; and a transferring unit 1500 moving the stage 1100 or moving the discharge unit 1200 and solidifying unit 1400. COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 KR101350948(B1) 申请公布日期 2014.01.14
申请号 KR20110143128 申请日期 2011.12.27
申请人 发明人
分类号 G03F7/20;G03F9/00;H01L21/00 主分类号 G03F7/20
代理机构 代理人
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