发明名称 |
Padless die support integrated circuit package system |
摘要 |
An integrated circuit package system is provided forming a die support system from a padless lead frame having die supports with each substantially equally spaced from another, and attaching an integrated circuit die having a peripheral area on the die supports. |
申请公布号 |
US8629537(B2) |
申请公布日期 |
2014.01.14 |
申请号 |
US20060339176 |
申请日期 |
2006.01.23 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY D.;TRASPORTO ARNEL;PUNZALAN JEFFREY D.;STATS CHIPPAC LTD. |
发明人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY D.;TRASPORTO ARNEL;PUNZALAN JEFFREY D. |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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