发明名称 |
Integrated circuit package with multiple dies and a multiplexed communications interface |
摘要 |
A package includes a first die and a second die, at least one of said first and second dies being a memory. The dies are connected to each other through an interface. The interface is configured to transport both control signals and memory transactions. A multiplexer is provided to multiplex the control signals and memory transactions onto the interface such that a plurality of connections of said interface are shared by the control signals and the memory transactions. |
申请公布号 |
US8629544(B2) |
申请公布日期 |
2014.01.14 |
申请号 |
US20100958622 |
申请日期 |
2010.12.02 |
申请人 |
JONES ANDREW MICHAEL;RYAN STUART;SCANDURRA ALBERTO;STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED;STMICROELECTRONICS S.R.L. |
发明人 |
JONES ANDREW MICHAEL;RYAN STUART;SCANDURRA ALBERTO |
分类号 |
H01L23/02;H01L29/40 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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