发明名称 |
Stress reduction apparatus with an inverted cup-shaped layer |
摘要 |
A stress reduction apparatus comprises a metal structure formed over a substrate, an inter metal dielectric layer formed over the substrate, wherein a lower portion of the metal structure is embedded in the inter metal dielectric layer and an inverted cup shaped stress reduction layer formed over the metal structure, wherein an upper portion of the metal structure is embedded in the inverted cup shaped stress reduction layer. |
申请公布号 |
US8629559(B2) |
申请公布日期 |
2014.01.14 |
申请号 |
US201213370161 |
申请日期 |
2012.02.09 |
申请人 |
LU YING-TI;CHEN WEN-TSAO;MAO MING-RAY;TSAI KUAN-CHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LU YING-TI;CHEN WEN-TSAO;MAO MING-RAY;TSAI KUAN-CHI |
分类号 |
H01L23/48;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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