| 摘要 |
The present invention is a heat radiation device for an LED lamp included on the top of an LED substrate having an LED device in the LED lamp. The present invention comprises a thermally conductive mold material comprising a first composition made of one among a phenoxy resin, a urethane-based catalytic curing resin, and a silicon-based catalytic curing resin; and a second composition made of one among low temperature cofired ceramic powder, aluminum nitride powder, boron nitride powder, and alumina powder. The heat radiation device is made of a solvent tank and a condensation pipe included on the top of the solvent tank. When the solvent tank is filled with solvent and the solvent is evaporated by heat of the LED lamp, the solvent is transferred to the condensation pipe through an evaporation pipe and then the solvent is transferred to the solvent tank through an exit pipe. The evaporation pipe is located on the top part within the solvent tank and the exit pipe is located on the lower part within the solvent tank. When the solvent tank is filled with the solvent, 10-80% of the solvent tank is filled with the solvent. Therefore, a small heat radiation device is mounted on the outside of the LED lamp in spite of using the solvent tank and the LED lamp which effectively radiates heat is manufactured. |
