发明名称 LED PACKAGE MANUFACTURING SYSTEM AND RESIN COATING METHOD FOR USE IN LED PACKAGE MANUFACTURING SYSTEM
摘要 <p>In resin coating, carrying a light-passing member test-coated with a resin on a light-passing member carrying unit; making a light source placed above the light-passing member carrying unit emit excitation light exciting the fluorescent substance; measuring light emission characteristics of the light by irradiating the excitation light emitted from the light source unit from above to the resin coated onto the light-passing member and receiving the light that the resin emits from below the light-passing member by a light emission characteristic measurement unit; obtaining a deviation between a measurement result of the light emission characteristic measurement unit and a prescribed light emission characteristic; and deriving the appropriate resin coating quantity of the resin to be coated onto the LED element as what is used for practical production based on the deviation.</p>
申请公布号 KR20140004736(A) 申请公布日期 2014.01.13
申请号 KR20137022237 申请日期 2012.05.30
申请人 PANASONIC CORPORATION 发明人 NONOMURA MASARU
分类号 H01L33/52;H01L33/48;H01L33/50 主分类号 H01L33/52
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