| 摘要 |
The present invention relates to a barrier coating aqueous solution preventing moisture permeation of a film for an electronic material. A multilayer film for packaging electronic parts is formed of a base film of the electronic material, having four layers obtained by successively stacking an outer layer, a central layer, an inner layer, and a coating layer. A surface layer is formed using low density polyethylene resin as a basic resin and an antistatic resin, and includes polyaniline, polypyrrole, polythiophene, polyethylendioxythiophene (PEDOT), derivatives thereof, and copolymers thereof. The central layer includes a resin which is a synthetic resin obtained by polymerizing ethylene of high density polyenthylene (HDPE) and is obtained by mixing HDPE, M-PE, and LLDPE. The inner layer is sealed into a thickness of 5-20 um using LLDPE as a basic resin. The coating layer is obtained by thermally cross-linking a PEG, PU, and LLDPE based emulsion solution on the inner layer into a thickness of 5-50 um for coating. The present invention provides the barrier coating aqueous solution preventing the moisture movement of the film for the electronic material which is formed of coating liquid for preventing the moisture movement of the film by being injected to the inside of an edge surface of the film while sealing the inside of the multilayer film. |
