摘要 |
Provided are a tin-plate copper alloy insulator with excellent insertion extraction properties and a manufacturing method thereof by lowering a copper friction coefficient to 0.3 or less while having excellent electric connection properties. A CuSn alloyed layer/a NiSn alloyed layer/Ni or a Ni alloyed layer are formed between an Sn-based surface layer and a basic material of Cu or Cu alloy. In the CuSn alloyed layer, Cu6Sn5 is a main component. The CuSn alloyed layer is a compound alloyed layer, where a part of Cu in Cu6Sn5 is substituted with Ni. In the NiSn alloyed layer, Ni3Sn4 is a main component. The NiSn alloyed layer is a compound alloyed layer, where a part of Ni in Ni3Sn4 is substituted with Cu. A local summit average interval (S) of the CuSn alloyed layer is 0.8-2.0 um inclusive, and an average thickness of the Sn-based surface layer is 0.2-0.6 um inclusive. An area rate of the CuSn alloyed layer exposed to a surface of the Sn-based surface layer is 1-40% inclusive, and an average of the diameter of the exposed part worth a circle is 0.1-1.5 um inclusive. A copper friction coefficient is not more than 0.3. [Reference numerals] (AA) Basic material |