| 摘要 |
PURPOSE: A laminated wiring layer for an electronic component and a sputtering target material for forming a coating layer are provided to improve waterproof properties and oxidation resistance by adding Ni and Ti to Mo with a preset ratio. CONSTITUTION: A main conductive layer(3) made of Cu as a main element is formed on a substrate(1). A coating layer(2,4) covers one side and/or the other side of the main conductive layer. The coating layer is formed by using a Mo alloy sputtering target. A composition expression of the coating layer satisfies Mo100-x-y-Nix-Tiy, 10<=x<=50, 3<=y<=30, and x+y<=53, wherein 20<=x<=30, 9<=y<=20. [Reference numerals] (1) Substrate; (2,4) Coating layer; (3) Main conductive layer |
