| 摘要 |
FIELD: instrument making.SUBSTANCE: in the initial stock they open windows in a layer of polymer, they fill these windows with a conducting material, they open windows in the conducting layer, they fill these windows with a polymer, after filling of the windows in the conducting layer with the polymer they separate the stock into separate parts, lay them in series into a packet and connect layers of the packet with the bearing substrate.EFFECT: expanded arsenal of methods to reduce cost of manufacturing and accelerate the process of creation of high-density electronic modules.29 dwg |
