JIG AND MANUFACTURING METHOD THEREOF AND FLIP CHIP BONDING METHOD FOR CHIPS COMPOSING ULTRASOUND PROBE USING JIG

摘要

The present invention relates to a jig. The jig comprises: a wafer; an accommodation groove which is formed by etching the wafer and accommodates a capacitive micromachined ultrasonic transducer (cMUT) when bonding a flip chip; and a separation groove formed by etching a part of the bottom surface of the accommodation groove. The jig prevents damage to a semiconductor chip having a double-sided design structure caused when bonding a flip chip by inserting a thin film of the cMUT into the accommodation groove toward the bottom surface of the separation groove and separating the thin film of the cMUT from the bottom surface of the separation groove when the jig is placed on the bottom surface of the accommodation groove which is not etched.