| 摘要 |
One embodiment of the present invention is to provide a semiconductor package capable of improving the appearance and the esthetic sense of a product and a method for manufacturing the same. According to one embodiment of the present invention, a semiconductor package includes a circuit substrate, a semiconductor chip, a sealing material, a base layer, and a color layer. The semiconductor chip is mounted in the circuit substrate. The semiconductor chip is covered with the sealing material. A base layer is located in the upper part of the sealing material not to expose the color of the sealing material. The color layer is located in the upper part of the base and displays color. |
