| 摘要 |
PURPOSE: To obtain a method of manufacturing a multilayered printed board, which is low in cost, is not complicated in the manufacturing method and has high-heat resistance, high-insulation property and low-dielectric constant blind via holes, a semiconductor carrier and a plastic semiconductor package. CONSTITUTION: A multilayered printed board having blind via holes is manufactured by a method wherein multilayered boards of a structure, wherein more than one layer of internal layer circuits are formed and the whole surfaces of both outermost layers are formed of a copper foil, are laminated using a copper-clad plate, which consists of a heat-resistant organic fiber, an unwoven fabric base material and a thermosetting resin, a base material of the same kind as the copper-clad plate, a prepreg constituted of a resin and/or a copper foil and after the laminated boards are formed into a multilayer structure, a laser beam is irradiated on the multilayered structure and the various via holes are formed at once. |
