| 摘要 |
<p>A method for transferring a wafer comprises the following steps. A transfer robot positions a jig, having a recognition mark, on a platen having multiple susceptors where wafers are put respectively. A first image which includes the recognition mark is obtained. The jig is moved horizontally as much as a set distance, and a second image which includes the recognition mark is obtained. Subsequently, correction data about camera images is obtained by comparing the moving distance of the recognition mark on the first and second images with the preset distance. To transfer the wafers, a third image which includes one of the susceptors is obtained, the actual position of the susceptors are determined by using the correction data and third image, and the wafers are accurately transferred on the susceptors by using the actual position. [Reference numerals] (AA) Start; (BB) End; (S100) Position a jig with a recognition mark on a platen; (S102) Obtain a first image having the recognition mark; (S104) Move the jig horizontally as far as a preset distance; (S106) Obtain a second image having the recognition mark; (S108) Obtain correction data about camera images by comparing the moving distance of the recognition mark on the first and second images with the preset distance; (S110) Obtain a third image having a susceptor positioned in a wafer load section; (S112) Determine the actual position of the susceptor by using the correction data and third image; (S114) Transfer the wafer to the susceptor by using the actual position</p> |
