| 摘要 |
A method for manufacturing packaged LED is provided in the present invention. A vacuum closed space is enclosed by a base plate and a cover plate, and LED chip on the base plate is disposed in the closed space. The cover plate includes a fluorescent layer, and space between the fluorescent layer and the LED chip is vacuum. Thus, heat generated by the LED chip may not affect fluorescent material inside the fluorescent layer so that the package of LED becomes more durable. |
