发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component that can efficiently manufacture the electronic component having excellent characteristics and including an external electrode formed by applying conductive paste and heat treatment to it.SOLUTION: When manufacturing the electronic component including the external electrode formed on the surface of an electronic component element, conductive paste, which is formed into paste by mixing conductive powder and a material containing at least a resin component and a solvent, and on which a defoaming process to remove air bubbles contained under a reduced pressure atmosphere has been performed is applied and heat-treated, and an electrode film making up at least a part of the external electrode is thereby formed. The conductive paste which contains conductive powder having an aspect ratio of 3 or more and conductive powder having an aspect ratio of less than 3, and in which the average aspect ratio of the whole conductive powder is not 2 or more is used.
申请公布号 JP2014003048(A) 申请公布日期 2014.01.09
申请号 JP20120135359 申请日期 2012.06.15
申请人 MURATA MFG CO LTD 发明人
分类号 H01G4/30;H01G4/12 主分类号 H01G4/30
代理机构 代理人
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