发明名称 PACKAGE FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, AND MANUFACTURING METHOD OF PACKAGE FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To ensure hermetic sealing of the internal space by using a sealing member, the manufacturing cost of which is reduced for a sealing member consisting of an Au-Sn layer.SOLUTION: A body housing 11 is provided with a base 3 on which a crystal vibration chip 2 is mounted, and a lid 5 which is bonded to the base 3 with a sealing member 8 interposed therebetween and sealing the crystal vibration chip 2 hermetically. In the sealing member 8, a first intermetallic compound 81 composed of a plurality of materials mainly consisting of Sn and Cu, and a second intermetallic compound 82 composed of a plurality of materials mainly consisting of Ag and Sn are distributed uniformly.
申请公布号 JP2014003239(A) 申请公布日期 2014.01.09
申请号 JP20120139114 申请日期 2012.06.20
申请人 DAISHINKU CORP 发明人
分类号 H01L23/02;H03B5/32;H03H3/02;H03H9/02 主分类号 H01L23/02
代理机构 代理人
主权项
地址