发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A method of manufacturing a semiconductor device, the method including forming a first gate electrode layer including a semiconductor material on a substrate; performing an annealing process on the first gate electrode layer; performing a dry cleaning process on a surface of the first gate electrode layer after the annealing process; and forming a second gate electrode layer on the first gate electrode layer after the dry cleaning process.
申请公布号 US2014011350(A1) 申请公布日期 2014.01.09
申请号 US201313937401 申请日期 2013.07.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SEONG CHOONGKEE;KIM KYUNGHYUN;PARK KIJONG;LEE JIN-I
分类号 H01L29/423 主分类号 H01L29/423
代理机构 代理人
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