| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of what is called a board product that since semiconductor chips are placed in matrix form in a device area on the device placement side of a multilayer organic wiring board and then laminated stepwise one on top of another before being die-bonded, a die bonder is required of highly accurate position recognition and positioning function, and that since the semiconductor chips prior to die-bonding have an adhesive layer formed on their reverse side to ensure the smooth execution of such a process and since die bonding is carried out at a temperature of about 150 degrees of centigrade, displacement due to the thermal expansion of the board could constitute the primary cause of positional deviation.SOLUTION: One invention applied herein relates to a semiconductor integrated circuit device manufacturing method. In a board product die-bonding process of the manufacturing method, the positions of two points on a circuit board are monitored while portions of the circuit board to which semiconductor chips are attached are heated, and then, after confirming that a designated stable temperature region is reached, the semiconductor chips are die-bonded. |
