| 摘要 |
PROBLEM TO BE SOLVED: To reduce the maintenance cost of a camera module, and to get the substitution effect of alignment adjustment process, and enhancement of productivity and investment cost reduction effect incident thereto.SOLUTION: The manufacturing apparatus for camera module includes a base jig for supporting a PCB from below, a rim tool for picking up an image sensor and bonding the image sensor onto the PCB, and a housing bonding tool for picking up a housing assembly and bonding the housing assembly onto the PCB so that the image sensor bonded onto the PCB is housed in the housing assembly. On the outside of the image sensor pickup of the rim tool, PCB support means which is brought into contact with the PCB and supports the PCB, when the image sensor is picked up by the pickup and bonded onto the PCB, is formed integrally with the image sensor pickup. |
