| 摘要 |
PROBLEM TO BE SOLVED: To increase area occupancy of a component which is contained and incorporated in a resin package.SOLUTION: A resin package array sheet includes resin packages which are arranged longitudinally and laterally. Each of the resin packages includes: a resin layer; a device which is included and embedded within the thickness of the resin layer; and a vertical-direction conductor which is arranged through a device-overlapping region of the resin layer so as to be connected to the device, or a vertical-direction conductor which is arranged through a no-device-overlapping region of the resin layer. A dummy region is provided adjacent to each region occupied by the resin package, and such regions occupied by the resin packages and the dummy regions are alternately arranged at least in one of the longitudinal and lateral directions. |
