| 摘要 |
Provided are a semiconductor package, a semiconductor device provided with the same, and a method of fabricating the same. The semiconductor package may include a package substrate including a central region and a peripheral region, a first semiconductor chip provided on the package substrate, a first connection pattern provided on the central region of the package substrate to connect the package substrate electrically to the first semiconductor chip, at least one second semiconductor chip provided on the peripheral region of the package substrate and between the package substrate and the first semiconductor chip, and a second connection pattern provided on the peripheral region of the package substrate to connect the first semiconductor chip electrically to the second semiconductor chip. |
