| 摘要 |
A semiconductor device housing package includes a base body having, on its upper surface, a mounting region of a semiconductor device; a frame body having a frame-like portion disposed on the upper surface of the base body, surrounding the mounting region, and an opening penetrating through from an inner side of the frame-like portion to an outer side thereof; a flat plate-like insulating member disposed in the opening, extending from an interior of the frame body to an exterior thereof; wiring conductors disposed on an upper surface of the insulating member, extending from the interior of the frame body to the exterior thereof; and a metallic film disposed on a part of the upper surface of the insulating member, the metallic film lying outside the frame body surrounding the wiring conductors. |
