发明名称 MOUNTING APPARATUS, METHOD FOR MOUNTING ELECTRONIC COMPONENT, PROGRAM, AND METHOD FOR MANUFACTURING SUBSTRATE
摘要 <p>[Problem] To provide a technology of a mounting apparatus or the like that is capable of improving production efficiency of substrates. [Solution] This mounting apparatus is provided with a mounting head, a transfer mechanism, and a control unit. The mounting head is capable of holding at least one electronic component, and mounts the holding electronic component on a substrate. The transfer mechanism transfers the mounting head in the height direction. On the basis of a classification table in which a plurality of electronic components having different sizes are classified into a plurality of groups corresponding to the sizes, the control unit determines to which group the electronic component to be mounted on the substrate belongs, adjusts, by means of the transfer mechanism, the height of the mounting head to the height corresponding to the group to which the electronic component belongs, and mounts the electronic component on the substrate by means of the mounting head having the height thereof adjusted.</p>
申请公布号 WO2014006809(A1) 申请公布日期 2014.01.09
申请号 WO2013JP03164 申请日期 2013.05.17
申请人 SONY CORPORATION 发明人 ITO, HIROAKI
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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