摘要 |
The present invention relates to a manufacturing method of a gallium nitride substrate, and a gallium nitride substrate manufactured by the same and, more specifically, to a manufacturing method of a gallium nitride substrate, and a gallium nitride substrate manufactured by the same which secures the thickness capable of handling of a gallium nitride substrate used for layer transference (LT) and prevents the cracks due to the flexure by minimizing a flexure phenomenon. The present invention provides the manufacturing method of the gallium nitride substrate comprising; a gallium nitride film growth step of growing up a gallium nitride film on a base substrate; and a base substrate separation step of separating the base substrate from the gallium nitride film. In the gallium nitride film growth step, a pit which induces the formation of an inversion domain of the inner side of the gallium nitride film is formed on the gallium nitride film. [Reference numerals] (AA) Start; (BB) End; (S1) First gallium nitride film growth step; (S2) Second gallium nitride film growth step; (S3) Third gallium nitride film growth step; (S4) Base substrate separation step; (S5) First gallium nitride film elimination step |
申请人 |
SAMSUNG CORNING PRECISION MATERIALS CO., LTD. |
发明人 |
LEE, SUNG KEUN;PARK, BO IK;WOO, KWANG JE;KIM, WOORIHAN;KIM, JOON HOI;PARK, CHEOL MIN;BAE, JUN YOUNG;LEE, DONG YONG;LEE, WON JO;CHOI, JUN SUNG |