发明名称 PATTERN PRINTING METHOD, MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a pattern printing method, a multilayer printed circuit board manufacturing method and a multilayer printed circuit board, which can reduce material cost by reducing the number of using dry films and which can perform efficient pattern printing.SOLUTION: A pattern printing method of a present embodiment comprises: forming a first pattern in a first region of a transfer film and a second pattern in a second region of the transfer film (S1); making the first region of the transfer film face a first area of a first subject and making the second region of the transfer film face a second area of a second subject (S2) and performing exposure/development/etching treatment (S3); and making the first region of the transfer film face a first area of the second subject and making the second region of the transfer film face a second area of the first subject (S4) and performing exposure/development/etching treatment (S5).
申请公布号 JP2014003214(A) 申请公布日期 2014.01.09
申请号 JP20120138688 申请日期 2012.06.20
申请人 NEC CORP 发明人 ASAKAWA MASAKATSU
分类号 H05K3/06;H05K3/46 主分类号 H05K3/06
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