| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that allows improving reliability.SOLUTION: A semiconductor device includes: a first semiconductor region; a second semiconductor region; a plurality of third semiconductor regions that are provided in the second semiconductor region and are juxtaposed in a first direction substantially orthogonal to the stacking direction of the first semiconductor region and the second semiconductor region; a fourth semiconductor region that is provided on the plurality of third semiconductor regions in an element region; a fifth semiconductor region that is provided on the fourth semiconductor region; a first electrode that is in contact with the second semiconductor region, the fourth semiconductor region, and the fifth semiconductor region via a first insulating film; a second electrode that is electrically connected to the fourth semiconductor region and the fifth semiconductor region; a third electrode that is electrically connected to the first semiconductor region; a plurality of fourth electrodes that are juxtaposed in the first direction on the plurality of third semiconductor regions and the second semiconductor region in a junction termination region; and a fifth electrode that is electrically connected to the third electrode and is provided on at least one of the plurality of fourth electrodes. |
