DETACHMENT SYSTEM, DETACHMENT METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To properly hold a treated substrate detached from a layered substrate and properly perform transfer or treatment of the treated substrate.SOLUTION: A detachment system comprises a holding mechanism 60 for holding a treated wafer W detached from a layered wafer in a non-contact manner when performing transfer or treatment of the treated wafer W. The holding mechanism 60 includes a body part 61 having a circular shape in planar view; and an annular first holding part 62 formed on a circumference of a circle concentric with the body part 61. The first holding part 62 includes a plurality of pairs of exhaust nozzles and each pair ejects gas outward and inward in a radial direction of the body part 61 from the center of the first holding part 62.