METHOD AND APPARATUS FOR STACKED SEMICONDUCTOR CHIPS

摘要

Stacked semiconductor chips include a bonding-wire-free interconnection electrically connecting the semiconductor chips to each. An opening in an adhesion layer between the semiconductor chips may provide a path for the interconnection from a bonding pad on one semiconductor chip, along a sidewall insulation layer of the semiconductor chip, along a sidewall insulation layer of another semiconductor chip to a bonding pad on the other semiconductor chip.