WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which can be prevented from being twisted and warped even when a core substrate is thinned.SOLUTION: The wiring board includes: a core substrate 10 provided with a first wiring layer 20; an interlayer insulating layer 40 which is formed of both a fiber reinforced material-containing resin layer 30 formed on the core substrate 10 and a primer layer 32 formed on the fiber reinforced material-containing resin layer 30 and is provided with a via hole VH1 reaching the first wiring layer 20; and a second wiring layer 22 which is formed on the primer layer 32 and is connected to the first wiring layer 20 via the via hole VH1.