| 摘要 |
PROBLEM TO BE SOLVED: To provide a ball grid array (BGA) package which allows BGA balls on an inner peripheral side to be reliably connected to the outside, even when the BGA package with a narrow BGA ball pitch is mounted on a through type substrate.SOLUTION: In a BGA package in which balls are aligned in a grid pattern on a joint surface with a substrate, the balls are not arranged at specific points in the grid, so that a lead-out wiring connected to the balls on a further inner circumferential side from the specific points can be formed in regions which correspond to the specific points on the substrate. |
