| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can properly achieve downsizing.SOLUTION: A semiconductor device comprises: a first lead frame having a bonding part 11; a second lead frame isolated from the first lead frame; a semiconductor element 2 electrically connected to the first lead frame and the second lead frame; and a case 3 for integrally covering a part of the first lead frame and a part of the second lead frame by resin molding while exposing a rear face of the first lead frame and a rear face of the second lead frame. The first lead frame further includes a first thin extension part 12 which extends from the bonding part and has a rear face located more inside the case from the exposed rear face of the first lead frame. The second lead frame includes a second thin extension part having a rear face located more inside the case from the exposed rear face of the second lead frame. The case 3 includes a holding part which wraps around a lower surface of the first thin extension part and a lower surface of the second thin extension part. |
