发明名称 MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a multilayer substrate capable of suppressing stress generation while at the same time protecting a peripheral portion of a land electrode, and to provide a manufacturing method of the multilayer substrate.SOLUTION: In a nonmagnetic paste 21, a portion (overlapping portion 23) where a peripheral part of a land electrode 22 and the nonmagnetic paste 21 overlap each other in plan view is raised in a lamination direction prior to crimping. In a nonmagnetic substrate 2, which is a second layer from an outermost layer on a lower surface side, a region which overlaps the overlapping portion 23 is removed (referred to as a removed region 31). When a laminate is crimped, the overlapping portion 23 is pushed in an inner layer side, but the nonmagnetic substrate 2 enters the removed region 31 so that stress is alleviated.
申请公布号 JP2014003044(A) 申请公布日期 2014.01.09
申请号 JP20120118230 申请日期 2012.05.24
申请人 MURATA MFG CO LTD 发明人 IEDA AKIHIRO;OTSUBO YOSHITO
分类号 H05K3/46 主分类号 H05K3/46
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