| 摘要 |
A deposition apparatus includes a deposition source unit for vaporizing a deposition material, a plurality of nozzles disposed on an upper surface of the deposition source unit for spraying the vaporized deposition material onto a substrate facing the upper surface of the deposition source unit, a plurality of angle restriction members disposed on the upper surface of the deposition source unit and located at left and right sides of the nozzles, and a plurality of first heater units, each of which is disposed on an upper surface of a corresponding angle restriction member of the angle restriction members. |
