发明名称 HEAT RADIATING MATERIAL FORSEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide the composite material of metallic material and inorganic material, which has the same property as Cu-W alloy at low costs. SOLUTION: This heat radiating material consists of the composite material containing 20wt.% or more silicon carbides and copper powder, and the thermal expansion coefficient is 6×10<-6> to 11×10<-6> /K or under, and Ag, Sn, and Si are added individually or by 0.3 to 8wt.% as (Ag+Sn) or (Ag+Si) to the said composite material for improvement of sintering density. Hereby, heat radiating member having excellent property can be obtained from the point of silicon carbide being inexpensive, the point of a three-dimensionally isotropic sintered substance high in density with small cavities being obtained, the point of it being excellent in heat conductivity since silicon carbides excellent in heat conductivity are mixed into a copper matrix, the point of thermal expansion coefficient being capable of being adjusted by changing the mixture ratio of copper to silicon carbides, the point of the complex between copper and silicon carbides being relatively light, and others.
申请公布号 JPH09260556(A) 申请公布日期 1997.10.03
申请号 JP19960093416 申请日期 1996.03.22
申请人 NHK SPRING CO LTD 发明人 HIROKAWA NORIKO;KAYAMOTO TAKASHI
分类号 C22C1/05;C22C9/00;H01L23/373;(IPC1-7):H01L23/373 主分类号 C22C1/05
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