| 摘要 |
Disclosed is a light emitting device package including a reflective substrate including a chip mounting region, a circuit substrate disposed on the reflective substrate, the circuit substrate including an inside edge defining the chip mounting region and at least one aligning hole disposed at a position spaced from the inside edge, and at least one light emitting diode chip disposed in the chip mounting region, the at least one light emitting diode chip being connected to the circuit substrate through a wire. |
