| 摘要 |
Provided are a sealing resin sheet, wherein a clean, smooth and flat ground surface is obtained by grinding after resin sealing, a method for producing an electronic component package using the same, and an electronic component package obtained by the production method. The present invention provides a sealing resin sheet, wherein a ground surface has a mean surface roughness Ra of 1 mum or less when grinding is performed under conditions of a grind bite peripheral velocity of 1000 m/minute, a feed pitch of 100 mum and a cut depth of 10 mum after a heat curing treatment is performed at 180� C. for 1 hour; and a Shore D hardness at 100� C. after the heat curing treatment is 70 or more. |
