发明名称 METHOD AND APPARATUS OF FORMING CARBON FILM
摘要 According to an embodiment of present disclosure, a method of forming a carbon film on a substrate to be processed is provided. The method includes loading a substrate to be processed with a carbon film formed thereon into a processing chamber of a film forming apparatus (Process 1), and thermally decomposing a hydrocarbon-based carbon source gas in the processing chamber to form a carbon film on the substrate to be processed (Process 2). In Process 2, a film forming temperature of the carbon film is set to a temperature less than a thermal decomposition temperature of a simple substance of the hydrocarbon-based carbon source gas without plasma assistance, the hydrocarbon-based carbon source gas and a thermal decomposition temperature drop gas containing a halogen element are introduced into the processing chamber, and a non-plasma thermal CVD method is performed.
申请公布号 US2014011368(A1) 申请公布日期 2014.01.09
申请号 US201313937902 申请日期 2013.07.09
申请人 TOKYO ELECTRON LIMITED 发明人 OBU TOMOYUKI;MIZUNAGA SATOSHI;OTSUKA TAKEHIRO
分类号 H01L21/02 主分类号 H01L21/02
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