| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for an optical semiconductor part which gives an encapsulating material and a sealing material excellent in heat resistance and UV-ray transmission resistance of a cured product, and capable of preventing or retarding accession of a sulfur-containing gas to the optical semiconductor part.SOLUTION: The composition for an optical semiconductor part includes a heat curable organosilicon compound (A), hydrosilylation catalyst (B), and zinc oxide (C). The heat curable organosilicon compound (A) has one or more unsaturated bond groups and one or more silicon atom-bonded hydrogen atoms in a molecule, and a heterocyclic ring represented by the following formula (1). |
