| 摘要 |
Provided is a method of manufacturing an LED package, the method including preparing a mold die (100) which includes an upper surface (100a) and a lower surface (100b,100c) having an outer circumferential surface (100b) and a concave surface (100c) surrounded by the outer circumferential surface, the mold die having an outlet extending (110) from the upper surface to the lower surface; preparing a base (200) having a light emitting section (230) formed therein; forming an inlet (270) formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound (280) into the inlet of the base; and removing the mold die. |
