| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive that can improve efficiency of light emission, is less likely to decolorize by heat or light, and shows practically sufficient die shear strength, in a process of manufacturing a light-emitting device by flip-chip mounting of a light-emitting element such as a light-emitting diode (LED) on a wiring board by use of an anisotropic conductive adhesive, without disposing a light-reflecting layer that causes an increase in the cost of manufacturing on the LED element, and to provide a light-emitting device by flip-chip mounting of a light-emitting element on a wiring board by use of the above adhesive.SOLUTION: The light-reflecting anisotropic conductive adhesive to be used for anisotropic conductive connection of a light-emitting element to a wiring board comprises a thermosetting resin composition, conductive particles and light-reflecting insulating particles. The thermosetting resin composition comprises a diglycidyl isocyanuryl-modified polysiloxane and a curing agent for an epoxy resin. |
