| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device capable of quickly cooling a solder bump or a bonder head for joining a semiconductor chip to a substrate.SOLUTION: A cooling device for a semiconductor chip bonder is provided with loop-type heat pipes 10 where an evaporation part 11 for depriving the outside of heat and a condensation part 12 for emitting heat outside communicate with each other in such a way as forming a circulation pipe line by a steam pipe 13 and a liquid return pipe 14 and condensible fluid is sealed up inside the circulation pipe line as working fluid. The evaporation part 11 is placed in the way that it deprives the solder bump heated melted of heat, the condensation part 12 is placed at a higher place than the evaporation part 11 so as to emit heat outside, and in the middle of the liquid return pipe 14 where working fluid whose heat is emitted and which is liquidized by the condensation part 12 is flown back to the evaporation part 11, an opening/closing valve 16 which closes the liquid return pipe 14 when heating and melting the solder bump and opens the liquid return pipe 14 when cooling and solidifying the solder bump. |
