Workpiece cutting, welding or bonding device

摘要

The device uses a cutting, welding or bonding adhesive application tool (9), e.g. a laser head, which is secured to a guide plate (7) displaced relative to the workpiece via a controlled holder. The holder is provided with a driven disc (1) which rotates relative to a console (2) with an eccentric perpendicular axis (4), to which the guide plate is secured via an angle piece (11).