Electro-optical module manufacture with double hardening of adhesive

摘要

The process secures an electro-optical component (3) into a recess (2) in the back of an optical waveguide termination socket (1). The optically and thermally hardenable epoxy adhesive (14) is deposited on the back (16) of a flange (2a). With the component positioned in the x-y plane for maximum optical coupling to the light guide, the adhesive is immediately hardened by ultraviolet illumination (30). The resulting bond is finalised in a subsequent and/or spatially separated process step by heating.